Government approves Rs. 55.32 billion projects to boost EV components
Autocar Professional, 28 Oct '25
The Government of India has approved the first tranche of seven projects under the Electronics Components Manufacturing Scheme (ECMS).
Union Electronics and IT Minister Ashwini Vaishnaw announced that the projects represent a combined investment of Rs. 55.32 billion (Rs. 626.2 million) and are expected to generate production valued at Rs. 365.59 billion, while creating more than 5,100 direct jobs.
The approved manufacturing units will produce multi-layer Printed Circuit Boards (PCBs), High-Density Interconnect (HDI) PCBs, camera modules, copper clad laminates, and polypropylene films. These components are used in automotive systems and electric vehicles, among other sectors.
Geographic distribution and production targets
The seven projects are distributed across three states: five units in Tamil Nadu, one in Andhra Pradesh, and one in Madhya Pradesh.
According to Vaishnaw, the new facilities will meet 100% of domestic demand for copper clad laminates, 20% of PCB requirements, and 15% of camera module sub-assembly needs. In addition, 60% of the total production is planned for export markets.
Strategic manufacturing capabilities
The approved projects include India's first copper clad laminate manufacturing facility. Copper clad laminate serves as the base material for multi-layer PCBs, which are currently imported. The domestic production of polypropylene films, used in manufacturing capacitors for automotive and industrial applications, will also commence.
Camera modules, which are used in automotive systems and electric vehicles, will now be manufactured domestically.
Economic implications
The Government expects that these projects will reduce import dependence and strengthen the domestic automotive component supply chain. The facilities are also expected to create employment opportunities in manufacturing and research and development.
The projects aim to support critical sectors such as electric vehicles by developing reliable local manufacturing infrastructure for essential electronic components.